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| Número de material | 1183233 |
| Referencia ISO | TNGN160412T02020 |
| Referencia ANSI | TNG333T0820 |
| Calidad | KY3500 |
| Tamaño IC de plaquita [D] | 9.525 mm |
| Tamaño IC de plaquita [D] | .375 in |
| Longitud de filo de corte de plaquita [L10] | 16.5 mm |
| Longitud de filo de corte de plaquita [L10] | .6496 in |
| Grosor de plaquita [S] | 4.76 mm |
| Grosor de plaquita [S] | .1875 in |
| Radio de esquina [Rε] | 1.2 mm |
| Radio de esquina [Rε] | .0468 in |
Grades
KY3500
Un materiale da taglio ceramico a base di microgranuli di Si3N4 da utilizzare principalmente nella lavorazione leggera e generale della ghisa grigia e della ghisa duttile ferritica. Si consiglia la lavorazione a secco.
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